Tesla plans to split Dojo 3 chip production, with Samsung handling front-end manufacturing and Intel taking on specialized packaging. This is a move away from TSMC’s full-process control. Samsung’s foundry to produce D3 chips will use the 2nm process for Tesla’s AI6 and Dojo 3. Intel will use leverage EMIB 2.5D packaging for Dojo’s large-scale ...

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Link :
https://www.nextbigfuture.com/2025/08/tesla-dojo-3-will-be-2-nanometer-chips-supplied-by-samsung-with-intel-packaging.html